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    HSEM-06PS

    HSEM-06PS

    HSEM-06PS Room Temperature Variable Field Probe Bench Hall Test System can be placed 4 inch wafer samples, using porous zoning control gas adsorption fixation, can provide a variable magnetic field environment, magnetic field size ± 0.6T , can be installed 6 probe arm. External connection to other electrical instrumentation can be at room temperature on the chip, wafer and device for non-destructive electrical testing, such as current, voltage, resistance and other electrical signals under different magnetic fields.

    HSEM-06PS Overview

    The HSEM-06PS Room Temperature Variable Field Probe Bench Hall Test System provides a vertically variable magnetic field environment for 4-inch samples and devices to be tested. External connections to other electrical test instruments allow non-destructive electrical testing of chips, wafers and devices at room temperature, such as electrical signals such as current, voltage, resistance, etc. under different magnetic fields.

    Features:
    - Sample holder holds 4" wafer samples with porous zoned controlled gas adsorption fixation. (Other sizes can be customised) 
    - Capable of providing variable magnetic field environments with magnetic field sizes ±0.6T 
    - 6 probe arms can be mounted 
    - The probe arms are magnetised and can be moved at will, and can be fine-tuned in three dimensions for easy operation and accurate pinning, and the probes of the four arms can be pinned to any position of the sample. 
    - The probe arm adopts tri-coaxial cable and tri-coaxial connector, the leakage current is small, within 100fA. 
    - CCD magnification is 180 times, working distance is 100mm.


    Test materials:
    - Thermoelectric materials: bismuth telluride, lead telluride, silicon-germanium alloys, etc.
    - Photovoltaic materials/solar cells: (A silicon (monocrystalline silicon, amorphous silicon), CIGS (copper indium gallium selenide), cadmium telluride, chalcogenide, etc.)
    - Organic Materials: (OFET, OLED)
    - Transparent Conductive Metal Oxide TCO: (ITO, AZO, ZnO, IGZO (Indium Gallium Zinc Oxide), etc.)
    - Semiconductor materials: SiGe, InAs, SiC, InGaAs, GaN, SiC, InP, ZnO, Ga2O3, etc.
    - Two-dimensional materials: graphene, BN, MoS2, etc.

    HSEM-06PS Technical Parameter


    HSEM-06PS Basic Configuration

    Semiconductor
    IC
    Wafer

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